Laser pulses enable precision slicing of lab-grown diamonds

Researchers from Chiba University have developed a strategy to slice lab-grown diamonds using ultrashort laser pulses. By inducing internal structural modifications, focused lasers create stresses that guide crack propagation, offering an alternative to mechanical machining for high-performance electronics.

The study, published in Diamond and Related Materials, compared high-pressure high-temperature (HPHT) and chemical vapor deposition (CVD) diamonds. Findings reveal that CVD diamonds respond to shorter pulses than HPHT variants. The team suggests that microscopic defects stemming from specific growth histories, rather than just nitrogen content, significantly influence how these crystals react to laser treatment.

Editor's note: Strong summary of the study findings and the technical context of diamond slicing.